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 Preliminary data
SPW17N80C2
Cool MOSTM Power Transistor
Feature
* * * * * *
C OLMOS O
Power Semiconductors
New revolutionary high voltage technology Worldwide best RDS(on) in TO 247 Ultra low gate charge Periodic avalanche rated Extreme dv/dt rated Ultra low effective capacitances
Product Summary
VDS R DS(on) ID
800 290 17
P-TO247
V mW A
Type SPW17N80C2
Package P-TO247
Ordering Code Q67040-S4359
Marking SPW17N80C2
Maximum Ratings, at T j = 25 C, unless otherwise specified Parameter Continuous drain current
TC = 25 C TC = 100 C
Symbol
Value 17 11 51 670 0.5 17 6 20 208 -55... +150
Unit A
ID
Pulsed drain current, tp limited by T jmax Avalanche energy, single pulse
ID=4A, V DD=50V
ID puls EAS EAR IAR
dv/dt
mJ
Avalanche energy, repetitive t AR limited by Tjmax1)
ID=17A, VDD=50V
Avalanche current, repetitive tAR limited by Tjmax Reverse diode dv/dt
IS=17A, V DS < V DD, di/dt=100A/s, T jmax=150C
A V/ns V W C
Gate source voltage Power dissipation
TC = 25 C
VGS Ptot Tj , Tstg
Page 1
Operating and storage temperature
2000-05-29
Preliminary data
Thermal Characteristics Parameter Characteristics Thermal resistance, junction - case Thermal resistance, junction - ambient, leaded Symbol min.
SPW17N80C2
Values typ. max. 0.6 62
Unit
RthJC RthJA
-
K/W
Linear derating factor Soldering temperature, 1.6 mm (0.063 in.) from case for 10s
-
-
1.67 260
W/K C
T sold
-
Electrical Characteristics, at T j = 25 C, unless otherwise specified Static Characteristics Drain-source breakdown voltage
V GS=0V, ID=0.25mA
V(BR)DSS V(BR)DS VGS(th) I DSS
800 2
870 3
4
V
Drain-source avalanche breakdown voltage
V GS=0V, ID=17A
Gate threshold voltage, VGS = VDS
ID=1mA
Zero gate voltage drain current
V DS = 800 V, V GS = 0 V, T j = 25 C V DS = 800 V, V GS = 0 V, T j = 150 C
A 0.5 250 0.7 25 250 100 290 nA mW
Gate-source leakage current
V GS=20V, V DS=0V
I GSS RDS(on) RG
Drain-source on-state resistance
V GS=10V, I D=11A, Tj=25C
Gate input resistance
W
f = 1 MHz, open drain
1Repetitve avalanche causes additional power losses that can be calculated as P =E *f. AR AV Page 2 2000-05-29
Preliminary data
Electrical Characteristics , at Tj = 25 C, unless otherwise specified Parameter Characteristics Transconductance Input capacitance Output capacitance Reverse transfer capacitance energy related Effective output capacitance, 2) Co(tr) time related Turn-on delay time Rise time Turn-off delay time Fall time
Gate Charge Characteristics Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage
SPW17N80C2
Symbol
Conditions min.
Values typ. 15 2320 1250 60 59 124 45 17 77 10 max. 88 13
Unit
g fs Ciss Coss Crss
V DS2*ID*R DS(on)max , ID=11A V GS=0V, VDS=25V, f=1MHz
-
S pF
Effective output capacitance, 1) Co(er)
V GS=0V, V DS=0V to 640 V
pF
t d(on) tr t d(off) tf
Q gs Q gd Qg
V DD=400V, VGS=0/10V, ID=17A, R G=5.6W, T j=125C
-
ns
VDD=640V, ID=17A
-
9 42 83 6
107 -
nC
VDD=640V, ID=17A, VGS=0 to 10V
V(plateau) VDD=640V, ID=17A
V
1C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 80% V DSS. 2C is a fixed capacitance that gives the same charging time as C while V is rising from 0 to 80% V .
o(tr) oss DS DSS
Page 3
2000-05-29
Preliminary data
Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Reverse Diode Inverse diode continuous forward current Inverse diode direct current, pulsed Inverse diode forward voltage Reverse recovery time Reverse recovery charge Symbol Conditions min.
SPW17N80C2
Values typ. 1 550 13 40 1200 max. 17 51 1.2 -
Unit
IS I SM VSD t rr Q rr
TC=25C
-
A
VGS=0V, IF=IS VR=400V, I F=I S ,
diF/dt=100A/s
-
V ns C A A/s
Peak reverse recovery current I rrm Peak rate of fall of reverse di rr/dt recovery current
Transient Thermal Characteristics Symbol Value typ. Transient thermal impedance Thermal resistance Unit Symbol
Value typ.
Unit
Thermal capacitance 0.00716 0.01 0.022 0.065 0.083 0.038 K/W
Rth1 Rth2 Rth3 Rth4 Rth5 Rth6
Cth1 Cth2 Cth3 Cth4 Cth5 Cth6
0.000441 0.0014 0.000985 0.0045 0.02 0.146
Ws/K
Tj P tot (t)
R th1
R th,n
T case
E xternal H eatsink
C th1
C th2
C th,n T am b
Page 4
2000-05-29
Preliminary data
1 Power dissipation 2 Drain current
SPW17N80C2
Ptot = f (TC)
SPW17N80C2
ID = f (TC )
parameter: VGS 10 V
SPW17N80C2
240
18
W
200 180
A
14 12
Ptot
160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120
ID
10 8 6 4 2 0 0
C
160
20
40
60
80
100
120
C
160
TC
TC
3 Safe operating area
4 Transient thermal impedance
I D = f ( V DS )
parameter : D = 0 , T C=25C
10
2
ZthJC = f (tp )
parameter : D = tp /T
10 1
tp = 6.7s
SPW17N80C2
SPW17N80C2
K/W
10 0
A
/I
D
10 s
V
DS
10 1
Z thJC
100 s
10 -1
ID
R
DS (
on )
=
10 -2 D = 0.50 0.20 10
0 1 ms
10
-3
0.10 0.05
10 ms
10 -4 DC 10 -1 0 10 10 -5 -7 10
single pulse
0.02 0.01
10
1
10
2
V
10
3
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
VDS
Page 5
tp
2000-05-29
Preliminary data
5 Typ. output characteristic
SPW17N80C2
6 Typ. output characteristic
I D = f (VDS); T j=25C parameter: tp = 10 s, V GS
70
ID = f (VDS ); Tj=150C
parameter: tp = 10 s, VGS
35
A
60 55 50 25
8V
20V 10V
A
20V 10V 8V 7V
6.5V 6V
ID
ID
20
45 40 35 30 25 20 15 10 5 0 0 5 10 15
7V 5.5V
15
6V
10
5V
4.5V 5V
5
4V
20
VDS
V
30
0 0
5
10
15
20
VDS
V
30
7 Typ. drain-source on resistance
8 Drain-source on-state resistance
RDS(on)=f(ID)
parameter: Tj=150C, V GS
1.5
RDS(on) = f (Tj )
parameter : ID = 11 A, VGS = 10 V
SPW17N80C2
1.6
A
1.3 1.2
W
RDS(on)
6.5V
1.2
ID
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0
4V 4.5V 5V
5.5V
6V
1.0
0.8
0.6
7V 8V 10V 20V
0.4
98% typ
0.2
5
10
15
20
25
VDS
V
35
0.0 -60
-20
20
60
100
C
180
Tj
Page 6 2000-05-29
Preliminary data
9 Typ. transfer characteristics
SPW17N80C2
10 Gate threshold voltage
I D= f ( VGS ); V DS 2 x ID x R DS(on)max
parameter: tp = 10 s
65
VGS(th) = f (Tj)
parameter: VGS = VDS , ID = 1 mA
5.0
A
25C
V
4.0
55 50
V GS(th)
45
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -60
max.
ID
40 35 30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16
150C
typ.
min.
V 20 VGS
-20
20
60
100
C
160
Tj
11 Typ. gate charge
12 Forward characteristics of body diode
VGS = f (Q Gate) parameter: ID = 17 A pulsed
SPW17N80C2
IF = f (VSD )
parameter: Tj , tp = 10 s
10 2
SPW17N80C2
16
V
A
12
VGS
0,2 VDS max 10
10 1
8
6
IF
10 0
0,8 VDS max
Tj = 25 C typ
4
Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)
10 -1 0.0
2
0 0
20
40
60
80
100
nC
140
0.4
0.8
1.2
1.6
2.0
2.4 V
3.0
Q Gate
Page 7
VSD
2000-05-29
Preliminary data
13 Avalanche SOA 14 Avalanche energy
SPW17N80C2
I AR = f (tAR)
par.: Tj 150 C
18
EAS = f (Tj )
par.: ID = 4 A, VDD = 50 V
700
A
14 12 10 8 6
T j(START)=25C
mJ
600 550
E AS
Tj (START)=125C
500 450 400 350 300 250 200 150 100 50
IAR
4 2 0 -3 10
10
-2
10
-1
10
0
10
1
10
2
s 10 tAR
4
0 25
50
75
100
C
150
Tj
15 Drain-source breakdown voltage
16 Avalanche power losses
V(BR)DSS = f (Tj)
SPW17N80C2
PAR = f (f )
parameter: EAR =0.5mJ
500
980
V
940
W
400 350 300 250
V(BR)DSS
920
880 860 840 820 800 780 760 740 720 -60 -20 20 60 100
P AR
900
200 150 100 50 04 10
5 6
C
180
10
MHz
10
Tj
Page 8
f
2000-05-29
Preliminary data
17 Typ. capacitances
SPW17N80C2
18 Typ. Coss stored energy
C = f (VDS)
parameter: V GS=0V, f=1 MHz
10 5
Eoss=f(VDS )
18
pF
10 4
J
14
Ciss
E oss
Coss Crss
100 200 300 400 500 600
12 10 8 6
10 3
C
10 2
10 1
4 2
10 0 0
V 800 VDS
0 0
100
200
300
400
500
600
V 800 VDS
Definition of diodes switching characteristics
Page 9
2000-05-29
Preliminary data
TO-247
SPW17N80C2
dimensions symbol min A B C D E F G H K L M N P Q 4.78 2.29 1.78 1.09 1.73 2.67 [mm] max 5.28 2.51 2.29 1.32 2.06 3.18 min 0.1882 0.0902 0.0701 0.0429 0.0681 0.1051 [inch] max 0.2079 0.0988 0.0902 0.0520 0.0811 0.1252
0.76 max 20.80 21.16 15.65 5.21 19.81 3.560 3.61 6.12 6.22 16.15 5.72 20.68 4.930
0.0299 max 0.8189 0.8331 0.6161 0.2051 0.7799 0.1402 0.6358 0.2252 0.8142 0.1941
0.1421 0.2409 0.2449
Page 10
2000-05-29
Preliminary data
Published by Infineon Technologies AG, Bereichs Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved.
SPW17N80C2
Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 11
2000-05-29


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